Part Number Hot Search : 
NJU25033 CO151 OM8508SC SG3561 LT1009 1H105K A3122ELT 16080
Product Description
Full Text Search
 

To Download STB10NB50 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  STB10NB50 n - channel 500v - 0.55 w - 10.6a - d 2 pak powermesh ? mosfet n typical r ds(on) = 0.55 w n extremely high dv/dt capability n 100% avalanche tested n very low intrinsic capacitances n gate charge minimized n add suffix ot4o for ordering in tape & reel description using the latest high voltage mesh overlay ? process, stmicroelectronics has designed an advanced family of power mosfets with outstanding performances. the new patent pending strip layout coupled with the company's proprietary edge termination structure, gives the lowest rds(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics. applications n high current, high speed switching n switch mode power supplies (smps) n dc-ac converters for welding equipment and uninterruptible power supplies and motor drive ? internal schematic diagram march 1999 1 3 absolute maximum ratings symbol parameter value unit v ds drain-source voltage (v gs =0) 500 v v dgr drain- gate voltage (r gs =20k w ) 500 v v gs gate-source voltage 30 v i d drain current (continuous) at t c =25 o c10.6a i d drain current (continuous) at t c = 100 o c6.4a i dm ( ? ) drain current (pulsed) 42.4 a p tot total dissipation at t c =25 o c135w derating factor 1.08 w/ o c dv/dt( 1 ) peak diode recovery voltage slope 4.5 v/ns t stg storage temperature -65 to 150 o c t j max. operating junction temperature 150 o c ( ? ) pulse width limited by safe operating area ( 1 )i sd 10.6a, di/dt 200 a/m s, v dd v (br)dss ,tj t jmax type v dss r ds( on) i d STB10NB50 500 v < 0.60 w 10.6 a d 2 pak to-263 1/8 4 .com u datasheet
thermal data r thj-case thermal resistance junction-case max 0.9 o c/w r thj-amb r thc-sink t l thermal resistance junction-ambient max thermal resistance case-sink typ maximum lead temperature for soldering purpose 62.5 0.5 300 o c/w o c/w o c avalanche characteristics symbol parameter max value unit i ar avalanche current, repetitive or not-repetitive (pulse width limited by t j max) 10.6 a e as single pulse avalanche energy (starting t j =25 o c, i d =i ar ,v dd =50v) 550 mj electrical characteristics (t case =25 o c unless otherwise specified) off symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d =250 m av gs =0 500 v i dss zero g ate voltage drain current (v gs =0) v ds =maxrating v ds = max rating t c =125 o c 1 50 m a m a i gss gate-body leakage current (v ds =0) v gs = 30 v 100 na on ( * ) symbol parameter test conditions min. typ. max. unit v gs(th) gate threshold voltage v ds =v gs i d = 250 m a 345v r ds(on) static drain-source on resistance v gs =10v i d = 5.3 a 0.55 0.60 w i d(o n) on state drain current v ds >i d(o n) xr ds(on )ma x v gs =10v 10.6 a dynamic symbol parameter test conditions min. typ. max. unit g fs ( * )forward transconductance v ds >i d(o n) xr ds(on )ma x i d =5.3 a 5 8 s c iss c oss c rss input capacitance output capacitance reverse transfer capacitance v ds =25v f=1mhz v gs = 0 1480 210 25 pf pf pf STB10NB50 2/8 4 .com u datasheet
electrical characteristics (continued) switching on symbol parameter test conditions min. typ. max. unit t d(on) t r turn-on time rise time v dd = 250 v i d =5.3a r g =4.7 w v gs =10v (see test circuit, figure 3) 25 13 ns ns q g q gs q gd total gate charge gate-source charge gate-drain charge v dd = 160 v i d =10a v gs =10v 38 10 17 49 nc nc nc switching off symbol parameter test conditions min. typ. max. unit t r(voff) t f t c off-voltage rise time fall time cross-over time v dd = 160 v i d =10a r g =4.7 w v gs =10v (see test circuit, figure 5) 13 15 25 ns ns ns source drain diode symbol parameter test conditions min. typ. max. unit i sd i sdm ( ? ) source-drain current source-drain current (pulsed) 10.6 42.4 a a v sd ( * ) forward on voltage i sd =10.6 a v gs =0 1.6 v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd =10.6 a di/dt = 100 a/ m s v dd =50v t j = 150 o c (see test circuit, figure 5) 560 4.9 17.5 ns nc a ( * ) pulsed: pulse duration = 300 m s, duty cycle 1.5 % ( ? ) pulse width limited by safe operating area safe operating area thermal impedance STB10NB50 3/8 4 .com u datasheet
output characteristics transconductance gate charge vs gate-source voltage transfer characteristics static drain-source on resistance capacitance variations STB10NB50 4/8 4 .com u datasheet
normalized gate threshold voltage vs temperature source-drain diode forward characteristics normalized on resistance vs temperature STB10NB50 5/8 4 .com u datasheet
fig. 1: unclamped inductive load test circuit fig. 3: switching times test circuits for resistive load fig. 2: unclamped inductive waveform fig. 4: gate charge test circuit fig. 5: test circuit for inductive load switching and diode recovery times STB10NB50 6/8 4 .com u datasheet
dim. mm inch min. typ. max. min. typ. max. a 4.3 4.6 0.169 0.181 a1 2.49 2.69 0.098 0.106 b 0.7 0.93 0.027 0.036 b2 1.25 1.4 0.049 0.055 c 0.45 0.6 0.017 0.023 c2 1.21 1.36 0.047 0.053 d 8.95 9.35 0.352 0.368 e 10 10.28 0.393 0.404 g 4.88 5.28 0.192 0.208 l 15 15.85 0.590 0.624 l2 1.27 1.4 0.050 0.055 l3 1.4 1.75 0.055 0.068 l2 l3 l b2 b g e a c2 d c a1 p011p6/c to-263 (d 2 pak) mechanical data STB10NB50 7/8 4 .com u datasheet
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibil ity for the consequences of use of such information nor for any infringement of patents or other rights of third part ies which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectro nics. specific ation mentioned in this publication are subjec t to change without notice. this publication supersedes and replaces all informat ion previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems with out express written approval of stmicroelectronics. the st logo is a trademark of stmicroelectronics ? 1999 stmicroelectronics printed in italy all rights reserved stmicroelectronics group of companies australia - brazil - canada - china - france - germany - italy - japan - korea - malaysi a - malta - mexico - morocco - the netherlands - singapore - spain - sweden - switzerland - taiwan - thailand - united kingdom - u.s.a. http://www.st.com . STB10NB50 8/8 4 .com u datasheet


▲Up To Search▲   

 
Price & Availability of STB10NB50

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X